| Form Factor | U.2 2.5-inch |
| Interface | SAS 3.0 |
| NAND Flash | 3D TLC |
| Available Capacity | 480GB | 960GB | 1.92 TB | 3.2 TB | 3.84 TB | 7.68 TB |
| Average Power Consumption (Idle, Active) | 5 W (idle); 11 W (active) |
| Weight (g) | < 200 g |
| TRIM | Supported |
| Power Failure Protection | Supported |
| Chip Failure Protection | Supported |
| Reliability | Meantime between failures (MTBF): 2.5 million hours; Annual failure rate (AFR): ≤ 0.35% ; Uncorrectable bit error rate (UBER): 10^-18 |
| Temperature | Non-operational: –40ºC to 85ºC (–40°F to 185ºF); Operational: 0ºC to 83ºC(32°F to 181.4ºF) |
| Data Retention (Power-off) | 3 months at 40ºC (104ºF) |
| Certifications | China: RoHS Europe: WEEE, RoHS, REACH, and CE Northern America: NRTL UK: UKCA Japan: VCCI Canada: IC Australia: RCM Member States of IEEE: CB |

